TDK's TAS FOUP Loadport - 300mm Wafer Loadport

Dear Customer,

TDK is proud to introduce it's Contamination Free, Clean Technology!

Our new TAS300 FOUP Loadport is matching the latest requirements of the Semiconductor Industry.

It is offers High Reliability and is Particle Contamination Free!

Advantages:

• Compatibility of pod
• Cushion mechanism that allows secure opening and closing of FOUP of each company
  • Entegris
  • Shin-Etsu Polymer
  • Kakizaki Mfg.
  • Dainichi Shoji
  • Asyst
• Particle free based on the total clean technology

Features:

• Complies with SEMI standard:
  • E15.1, E57, E62, E63, E64 , S2 and S8
• Simple, Robust (MTBF>150,000 hrs), Cost Effective pneumatic operation.
• Port Door has excellent durability for repetitive operations.
• No need to adjust Loadport for each FOUP vendor.
• Available option:
  • Mapping Unit with Double Wafer Detection
  • CID Kit
  • CE

Downloads:

TAS300 Product Details

Type E3 Characteristics (PDF)
Type E4 Characteristics (PDF)

TAS300 Specifications

Type E3 Specifications (PDF)
Type E4 Specifications (PDF)