Welcome to TDK Europe's Factory Automation Website

Focusing on quality & reliability, TDK remains a leader in Factory Automation solutions for both Front End & Back End applications.

This web-site features information on TDK's FA product portfolio.


Please choose from below product categories.


TAS300 FOUP Loadport

TDK is proud to introduce it’s Contamination Free, Clean Technology!
It is offers High Reliability and is Particle Contamination Free!
It also features a compatibility of the pod.

» Product Details


AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process)

Low-energy bonding enables bonding with 30% to 50% less energy consumption than other companies’ products.
For high precision cost-sensitive applications!
Features a small footprint.

» Product Details